NEW THERMOSETS FLOW ANALYSIS GIVES QUALITY AT LOW COST

(Shelton, Connecticut -- October 15, 1993) Moldflow Pty., the world's
leader in CAD technology for the plastic injection molding industry,
announces MOLDFLOW/TSETS. The ability of the thermoset molding industry to
deliver quality products will be helped significantly by this new
thermosets flow analysis software package from Moldflow Pty. Ltd. Using
MF/TSETS the thermosets engineer can study material behavior inside the
mold as it fills to diagnose and correct anticipated problems prior to
mold building. The result - maximum product quality at minimum production
cost.

Moldflow, world leader in thermoplastics analysis, has developed strategic
alliances with market leaders in thermoset molding and material testing to
ensure that MF/TSETS meets the practical needs of the thermosets industry.
Specifically, MF/TSETS process simulation and optimization software is
tailored for Reaction Injection Molding (RIM), Transfer Molding, I.C. Chip
Encapsulation, Bulk Molding Compound (BMC) injection molding and Resin
Transfer Molding (RTM).

The IC chip encapsulation industry in particular is a competitive market
that requires high quality thermosets molding. An ever expanding range of
electronic products demand sophisticated integrated circuits. Quality of
IC chips is crucial, a substandard chip that causes product malfunction is
a very expensive problem. When molding thermoset material the IC chip
encapsulator experiences problems with wire sweep and voids, problems that
cannot be visually detected after molding. Molding reject rates are high,
production costs become uncompetitive.

MF/TSETS uses finite element analysis to simulate the IC Chip encapsulation
process. 3D graphical results predict wire sweep, voids and weld line
placement. Mold design can then be optimized to avoid these problems.
Other graphical displays of melt temperature, shear rate and gelled layer
analyze and refine the molding process.

Automatic runner balancing maintains uniform filling pressure and polymer
flow to each cavity to minimize wire sweep and material wastage. MF/TSETS
predicts the effects of cure, and accounts for the heating of material in
the transfer pot prior to, and during injection.

MF/TSETS enables the thermosets molder to produce parts of known and
reliable quality, without resorting to extensive trial and error mold
commissioning. Reduced time to market and significant savings in
production costs help win business against competition from other
thermosets molders and the thermoplastic industry.

Moldflow, Inc. has pioneered computerized analysis of plastic injection
molding, which improves product performance, reduces scrap, shortens
design leadtimes and lowers design and manufacturing costs. Independent
studies have shown that the company has a dominant market share in its
area of specialty throughout the world. Products include: MOLDFLOW/FLOW --
which predicts flow patterns and characteristics within the mold;
MOLDFLOW/COOL --- which analyzes the vital role of heat exchange and
temperature control in the mold; MOLDFLOW/WARP which analyzes the net
distortion of the actual molded part and helps determine its mechanical
properties; MOLDFLOW/SHRINK -- a finite element analysis tool that meets
mold designer needs by predicting an optimum shrinkage value to meet
critical molding dimensions; MOLDFLOW/GAS -- designed to simulate and
analyze the emerging technology of Gas Injection Molding (GIM); and
MOLDFLOW/STRESS -- a structural analysis tool for fiber reinforced
plastics.

Moldflow Inc, 2 Corporate Dr, Suite 232, Shelton, CT 06484
203-925-0552;  fax: 203-925-1175

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