ANSOFT AND CADENCE SIGN JMA

Ansoft Plans To Integrate Maxwell Spicelink 3D Field Solver with Cadence's
New Multi-level Signal Integrity Analysis Solution

PITTSBURGH, Pa, November 22, 1993 --Ansoft Corporation today announced that
it has signed a joint marketing agreement with Cadence Design Systems of
San Jose, CA. Under the terms of the agreement Ansoft plans to integrate
its Maxwell Spicelink 3D Field Solver with Cadence's new multi-level
signal integrity solution--DF/SigNoise.

"We see this relationship as being very beneficial for design engineers,"
said Keith Franz, Ansoft's vice president of sales and marketing. "Because
of the increasing awareness and concerns about problems resulting from
signal integrity issues with high-performance MCMs, PCBs, backplanes and
entire systems, design engineers are more aware of their need for better
signal integrity solutions. Working with Cadence, one of the largest
software suppliers in the EDA industry, and being part of their
DF/SigNoise solution gives us access to more engineers who need the proven
capabilities of Maxwell Spicelink."

"Our multi-level approach offers a signal integrity solution to both design
engineers and signal integrity experts," said Shiv Tasker, vice president
and general manager of Cadence's systems physical group. "With the
seamless integration of Ansoft's proven 3D solids modeling and field
solution products with DF/SigNoise, users can choose an appropriate level
of modeling detail and performance during every phase of the design
process from technology exploration to post-layout verification."

Padmanabhan Premkumar, Ansoft's manager of product development, said of the
integration, "The Interconnect Description Language (IDL) based open
architecture of Cadence's DF/SigNoise made it easy for us to integrate
Maxwell Spicelink." Premkumar added, "Seamless integration of modeling,
meshing and field simulation required for the extraction of 3D LCRG
parameters has been the cornerstone of Maxwell products. Integration with
DF/SigNoise adds value by bringing a unique and comprehensive design
solution that leverages literally decades of Ansoft expertise into a
broader system level solution. "

The few 3D simulation tools available today have serious shortcomings in
their modeling capability, often requiring users to purchase an external
tool for an additional cost of at least 20K. Maxwell Spicelink defines a
new standard for modeling ease and power by featuring a fully functional
and graphic interactive 3D solids modeler for generating 3D models of any
general shape. The package includes targeted modeling tools like the
ParICs Physical IC Modeler for automatically generating 3D package models
based on IEDEC standards. A Multi-Layer Interconnect Modeler (MIM)
automates the generation of true 3D models from multiple layer information
found in DXF, Gerber or GDSII files. Cadence and Ansoft both offer
translators from mechanical CAD systems such as SDRC, Unigraphics,
ProEngineer, etc.

Cadence's open architecture and Ansoft's 3D modeling capabilities synergize
to serve the needs of both signal integrity experts and design engineers.
An expert user has the ultimate flexibility to play what-if games and
model any arbitrary geometry and generate a library of models for
packages, connectors, cables, vias and non-ideal ground structures. When
the design engineer uses DF/SigNoise, the parasitic information for these
3D geometries will be automatically extracted from this library, without
the expense of hours or days of simulation on each signal.

Ansoft Corporation has ova 600 customers in the United States, Europe and
Asia Pacific, with customers in the semiconductor, communications,
computer and aerospace sectors. Founded in 1984 by Zoltan Cendes,
internationally renowned authority in electromagnetics, Ansoft entered the
EDA market with Maxwell Spicelink in 1992. Ansoft is a privately held
company and headquartered at Four Station Square, Suite 660, Pittsburgh,
PA 15219-1119 USA. Phone 412-261-3200. Fax 412-471-9427. Internet
info@ansoft.com

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